Vapor SUI Clean
Cleaning after die bond; Cleaning of 3D package; Micro-standoff precisely cleaning SIP and microwave assembly cleaning; Cleaning before chip packaging; Cleaning before PCBA coating Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF; Apply for assemblies of water-free cleaning Factory which dosent permit wastewater discharge;
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Cleaning Application

Cleaning after die bond

Cleaning of 3D package

Micro-standoff precisely cleaning

SIP and microwave assembly cleaning

Cleaning before chip packaging

Cleaning before PCBA coating

Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF;

Apply for assemblies of water-free cleaning

Factory which does not permit wastewater discharge


Unique Advantage:

Unique double flow cleaning technology ---- SUI, which with high flow spray under immersion sump up to 500L/min.
Spray under immersion+bubbling+vertically oscillated of basket, even no ultrasonic to achieve perfect cleaning result.(132Hz ultrasonic cleaning optional)
Waterfree cleaning process is apply for cleaning after die bond, which can rinse the organics thoroughly.
Multi-cycles vapor rinse to improve flexibility of cleaning process.
Double refrigeration system+ Double-seal technology, strictly control the volatilization of solvent, no harm to operator and environment friendly.
Cleaning process can be set flexibly according to cleaning application.
Wide range of customized basket and fixture.