Removing all kinds of solder residues Cleaning of micromechanical components Cleaning contamination from handling and board manufacturing, removing FOD Cleaning highly populated electronic assemblies with low standoff such as BGA,CSP.BTC,QFN,MELF Cleaning of power electronics Electronic assemblies requiring extra short process time Second side misprints on complex assemblies Cleaning before conformal coating and wire bonding

Cleaning application

 Removing all kinds of solder residues

 Cleaning of micromechanical components

 Cleaning contamination from handling and board manufacturing, removing FOD

 Cleaning highly populated electronic assemblies with low standoff such as BGA,CSP.BTC,QFN,MELF

 Cleaning of power electronics

 Electronic assemblies requiring extra short process time

 Second side misprints on complex assemblies

 Cleaning before conformal coating and wire bonding

Unique advantages

 Fully automatic spray-in-air closed loop zero drain system

 Triple capacity configuration

 Linear direct spray for equal washing of entire surface

 100% filtration of entire spray volume

 Optional triple rinse

 Hot air knife direct dry technology

 Window for visual process control

 All process steps with up to 5 substeps for highest flexibility

 Wide range of standard and customized PCBA fixtures

 Clamping for all types of stencils

 Up to 3 fully separated liquid loops

 Low consumption of chemicals and water

 Proportional level sensors in all processes

 Outstanding options of water utilization