Heating plate series is apply to weld between component and substrate ,substrate and shell in process of microelectronics packaging and assembly such as: hybrid circuit、optical fiber electronic device.

Feature:

Square worktable can make sure widely effective heating area. 

Independent temperature control to ensure the welding process. 

Adjustable temperature can be set. 

Uniform temperature distribution of heating table.

Equipment frame with heat insulation protection, avoid scalding. 

Reasonable structure is easy to operate and maintain.