Vapor SUI Clean
Cleaning after die bond;
Cleaning of 3D package;
Micro-standoff precisely cleaning
SIP and microwave assembly cleaning;
Cleaning before chip packaging;
Cleaning before PCBA coating
Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF;
Apply for assemblies of water-free cleaning
Factory which dosen¡¯t permit wastewater discharge;